EE Solutions has successfully tape-out a Multimedia SoC for a top-rated fabless company in Korea. The SoC has two embedded ARM9 processors running at 370MHz and cell count is over 1M gate plus 228 Macros. The challenge includes multiple voltage islands (2 switched power domain, 1 stand-by domain), multi-vt and the IR drop need to be less than 5%. EE Solutions implemented the Deep Submicron Design flow to successful tape-out the SoC with TSMC 80nm process with 1 poly 6 layer metals and the final die size is 6000um x 6000um.