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Yield & Failure Analysis
Primary responsibility of our Product Engineering group is to maximize yield from each wafer. EE Solutions monitor yields and work closely with both the foundry engineers and assembly house to maximize the yield in order to get the best possible cost to our customers.
EE Solutions offers a full range of quality services for the entire product life cycle. Yield optimization services include yield analysis, corner lot characterization and process re-targeting. We assist customers during the validation and debugging phase by providing benchmark measurements. EE Solutions provides die and packaging qualification including burn-in, ESD, latch up and high accelerated stress test.
We provide complete support to new products including new product qualification, sophisticated failure analysis and optimization.
 The skill of yield improvement
Design Window vs. Process Margin Check
Product Reliablity Qualification
- Reliability qualification requested by customers
- Qualification plan, sampling size, items
- Base on customer plan
- Reference on the industrial standard
- Reference from assembly house
- Provide the Reliability Report
- Data analysis and suggestion
- Provide the failure analysis & corrective action
Total Solutions on Reliability Test
| Test Item |
Test Condition |
Readout (Hour or Cycle) |
Test Method |
| Operating Life Test (OLT) |
Ta = 125¢J, .3*Vcc
Rated current
I = 30 mA
VR = 32V |
168/500/1000 (HR) |
MIL-STD-750C
MIL-STD-883D
METHOD 1005.7
CONDITION D
METHOD 1027.1 |
| Pressure Cooker Test (PCT) |
Ta = 121¢J
P = 15psig, (2ATM)
RH = 100% |
48/96/168 (HR) |
MIL-STD-19500E |
| Moisture Resistance |
Ta = 85¢J
RH = 85% |
168/500/1000 (HR) |
MIL-STD-750C
MIL-STD-883D |
| Temperature Humidity test (THT) |
Ta = 85¢J
RH = 85% |
168/500/1000 (HR) |
JEDEC22-A101-B |
| Temperature Humidity with Bias Test (THBT) |
Ta = 85¢J
RH = 85%
Bias¡G0~60V
Current¡G¡Ø6A |
168/500/1000 (HR) |
JEDEC22-A101-B |
| Thermal Shock Test (TST) |
-55¢J/5mins to 150¢J/5mins |
100 CYC |
MIL-STD-750C
MIL-STD-883D |
| Temperature Cycling Test (TCT) |
-55¢J/15mins to 125¢J/15mins,
Dwell time¡G1~5mins |
500/1000 CYC |
MIL-STD-750C
MIL-STD-883D
METHOD 1051.2 CONDITION C
JESD22-A104-B |
| High Temperature Storage Life |
Ta = 150¢J |
168/500/1000 (HR) |
MIL-STD-750C
JESD22-A103-B |
Total Solutions on ESD, Latch-up Test
Test Item |
Test Condition |
Readout
(Hour or Cycle) |
Test Method |
| Electrostatic Discharge (ESD) |
Ta = 25¢J, RH < 55%,
Vdd & Vss to all pins
HBM ¡Ö 2KV
MM ¡Ö 200V |
VSS (¡Ó)
VCC (¡Ó)
VCC ¡V VSS (¡Ó) |
JESD22-A114-B |
| Latch-Up |
Ta = 25¢J,
+/- Current Trigger |
+Voltage Trg ¡VVoltage Trg |
EIA/JESD78 |
| ELECTRO MIGRATION (EM) |
Follow JEDEC |
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>1.0 mA/um JESD63 |
| Solder ability |
Ta = 215 ¡Ó 5¢J
Dipping depth= 1~1.5mm |
Dipping 5sec |
MIL-STD-750C |
Total Solutions on Failure Analysis
- Electrical Analysis
- Curve Tracer, Logic Analyzer
- Signal Generator
- HP 4145, 4156
- Package Level Analysis
- X-ray, SAM
- De-cap, Dry Plasma Etched
- Leakage Current Analysis
- EMMI, Liquid Crystal, Hot Spot
- O Birch
- Physical Analysis
- SEM, TEM, FIB, u-scope
Failure Analysis
(1) X-ray Analysis
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Golden wire / Ball Anaylysis |
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(2) De-Cap Analysis
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Passivation Layer, Top side review |
(3) Emission Analysis
(4) SAM
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