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Fabrication
Package & Assembly
Test Development
Yield & Failure Analysis
Post Fabrication

 

Fabrication

EE Solutions partners with world class foundries to provide complete manufacturing services. EE Solutions staff brings years of Semiconductor manufacturing experience and product engineering experience to every engagement. We work closely with our customers to select the right process and technology solution for their designs. This requires careful comparisons between different foundries, objectives and target price. Our manufacturing engineering staff keeps abreast of the changes and stays current with all existing and new technologies to ensure complete choice.

EE Solutions provides a unique service that delivers fast, inexpensive IC prototypes with special features not provided by foundries. Currently foundries require purchasing a complete mask set or consists of multi-project wafer services with limited package and test options. Since only a limited number of standard packages are available with multi-project wafer services, customer must settle for bare, unpackaged and untested die.

EE Solutions offers complete integrated IC prototyping service that can deliver any thing from bare die to packaged, fully tested parts. In this option, EE Solutions supports full complement of packages including custom packages. In addition we can perform basic electrical and functional tests.

 

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