Nanometer Design Flow

Several analysis flow and prevention mechanism were deployed to handle those nanometer design:

• OCV (On Chip Variation) analysis
• Multi-corner RC conditions handling
• SSTA: Statistical Static Timing Analysis
• Multi-mode constrains timing optimization
• Advance DFT: Scan Compression, Power/Speed aware test
• Design for Manufacturing analysis:
  - CAA: Critical Area Analysis, wire spreading and wire widing
  - CMP: CMP hot-spot analysis and metal filling
  - Redundant via insertion